Seizo breaks ground on third manufacturing campus in Pune
The new 120,000 sq ft facility will add eight SMT lines dedicated to power modules and automotive-grade sensors, with production slated for Q3 2027.
Seizo Electronics designs and manufactures microcontrollers, passives, power modules, connectors, sensors, and displays — shipped to engineers in 40+ countries.
2.4B+
Components shipped annually
99.98%
Outgoing quality yield
40+
Countries served
25
Years of manufacturing
Trusted across industries
Our Businesses
The brains of every board
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Precision in every value
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Efficiency without compromise
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Signal integrity, guaranteed
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The physical world, digitized
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Interfaces that shine
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Capabilities
5 R&D centers advancing materials, packaging, and next-node designs.
Application engineering and rapid prototype runs in under two weeks.
14 SMT lines with closed-loop AOI across three campuses.
100% electrical test, burn-in screening, and 99.98% outgoing yield.
Moisture-controlled packing and 40+ country distribution network.
Our Footprint
3
Manufacturing campuses
14
SMT production lines
5
R&D centers
8,000+
Employees worldwide
Gurugram, India
Headquarters & main manufacturing campus
Munich, Germany
EMEA sales & application engineering
Austin, USA
Americas sales & design support
Audited continuously for automotive, medical, and industrial markets.
What Engineers Say
“Seizo's application engineers caught a thermal issue in our design review that would have cost us a board respin. That's what a component partner should be.”
Director of Hardware Engineering
EV powertrain manufacturer, Germany
“Zero line-down events in four years of supply. Their lot-level traceability made our IATF audit the easiest we have ever had.”
VP of Supply Chain
Tier-1 automotive supplier, India
“We moved our sensor BOM to Seizo for cost, but we stayed for the documentation quality and the response times.”
Principal Engineer
Medical device OEM, USA
Newsroom
The new 120,000 sq ft facility will add eight SMT lines dedicated to power modules and automotive-grade sensors, with production slated for Q3 2027.
A multi-year agreement secures silicon-carbide substrate capacity, supporting the ramp of our 1200 V half-bridge module family for electric mobility.
A decade after entering MEMS sensing, cumulative shipments crossed a quarter billion units — with zero field recalls across the product family.
Send us your BOM or requirements. Our application engineers respond within one business day with availability, pricing, and alternates.